Erik Jan Marinissen
Challenges and emerging solutions in testing TSV-based 2 1 over 2D- and 3D-stacked ICs
DATE, 2012.
@inproceedings{DATE-2012-Marinissen,
acmid = "2493023",
author = "Erik Jan Marinissen",
booktitle = "{Proceedings of the 16th Conference and Exhibition on Design, Automation and Test in Europe}",
isbn = "978-1-4577-2145-8",
pages = "1277--1282",
publisher = "{IEEE}",
title = "{Challenges and emerging solutions in testing TSV-based 2 1 over 2D- and 3D-stacked ICs}",
year = 2012,
}











