Travelled to:
2 × USA
Collaborated with:
S.S.Sapatnekar P.Saxena
Talks about:
placement (2) interlay (1) consider (1) thermal (1) weight (1) repeat (1) reduc (1) count (1) dure (1) net (1)
Person: Brent Goplen
DBLP: Goplen:Brent
Contributed to:
Wrote 2 papers:
- DAC-2007-GoplenS #3d
- Placement of 3D ICs with Thermal and Interlayer Via Considerations (BG, SSS), pp. 626–631.
- DAC-2005-GoplenSS
- Net weighting to reduce repeater counts during placement (BG, PS, SSS), pp. 503–508.