@inproceedings{DAC-2011-CongLS,
	author        = "Jason Cong and Guojie Luo and Yiyu Shi",
	booktitle     = "{Proceedings of the 48th Design Automation Conference}",
	doi           = "10.1145/2024724.2024876",
	isbn          = "978-1-4503-0636-2",
	pages         = "670--675",
	publisher     = "{ACM}",
	title         = "{Thermal-aware cell and through-silicon-via co-placement for 3D ICs}",
	year          = 2011,
}