Travelled to:
1 × France
1 × USA
Collaborated with:
J.Cong Y.Shi J.Shin J.A.Darringer A.J.Weger C.L.Johnson
Talks about:
placement (1) thermal (1) silicon (1) cockpit (1) earli (1) plan (1) chip (1) cell (1) awar (1)
Person: Guojie Luo
DBLP: Luo:Guojie
Contributed to:
Wrote 2 papers:
- DAC-2011-CongLS #3d
- Thermal-aware cell and through-silicon-via co-placement for 3D ICs (JC, GL, YS), pp. 670–675.
- DATE-2011-ShinDLWJ
- Early chip planning cockpit (JS, JAD, GL, AJW, CLJ), pp. 863–866.