@inproceedings{DAC-2012-JungPL,
	author        = "Moongon Jung and David Z. Pan and Sung Kyu Lim",
	booktitle     = "{Proceedings of the 49th Annual Design Automation Conference}",
	doi           = "10.1145/2228360.2228419",
	isbn          = "978-1-4503-1199-1",
	pages         = "317--326",
	publisher     = "{ACM}",
	title         = "{Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs}",
	year          = 2012,
}