Design, packaging, and architectural policy co-optimization for DC power integrity in 3D DRAM
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Yarui Peng, Bon Woong Ku, Youn-Sik Park, Kwang-Il Park, Seong-Jin Jang, Joo-Sun Choi, Sung Kyu Lim
Design, packaging, and architectural policy co-optimization for DC power integrity in 3D DRAM
DAC, 2015.

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@inproceedings{DAC-2015-PengKPPJCL,
	author        = "Yarui Peng and Bon Woong Ku and Youn-Sik Park and Kwang-Il Park and Seong-Jin Jang and Joo-Sun Choi and Sung Kyu Lim",
	booktitle     = "{Proceedings of the 52nd Annual Design Automation Conference}",
	doi           = "10.1145/2744769.2744819",
	isbn          = "978-1-4503-3520-1",
	pages         = "6",
	publisher     = "{ACM}",
	title         = "{Design, packaging, and architectural policy co-optimization for DC power integrity in 3D DRAM}",
	year          = 2015,
}

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