Travelled to:1 × USA
Collaborated with:Y.Peng Y.Park K.Park S.Jang J.Choi S.K.Lim
Talks about:architectur (1) polici (1) packag (1) integr (1) design (1) power (1) optim (1) dram (1)
Person: Bon Woong Ku
DBLP: Ku:Bon_Woong
Contributed to:
2015Wrote 1 papers:
- DAC-2015-PengKPPJCL #3d #architecture #design #policy
- Design, packaging, and architectural policy co-optimization for DC power integrity in 3D DRAM (YP, BWK, YSP, KIP, SJJ, JSC, SKL), p. 6.