Alain Fourmigue, Giovanni Beltrame, Gabriela Nicolescu
Efficient transient thermal simulation of 3D ICs with liquid-cooling and through silicon vias
DATE, 2014.
@inproceedings{DATE-2014-FourmigueBN,
author = "Alain Fourmigue and Giovanni Beltrame and Gabriela Nicolescu",
booktitle = "{Proceedings of the 18th Conference and Exhibition on Design, Automation and Test in Europe}",
doi = "10.7873/DATE.2014.087",
pages = "1--6",
publisher = "{IEEE}",
title = "{Efficient transient thermal simulation of 3D ICs with liquid-cooling and through silicon vias}",
year = 2014,
}