Travelled to:
1 × Germany
4 × France
Collaborated with:
G.Nicolescu G.Beltrame E.M.Aboulhamid I.O'Connor B.Girodias H.Li S.L.Beux X.Letartre
Talks about:
thermal (4) simul (3) transient (2) liquid (2) design (2) cool (2) base (2) interconnect (1) architectur (1) wireless (1)
Person: Alain Fourmigue
DBLP: Fourmigue:Alain
Contributed to:
Wrote 5 papers:
- DATE-2015-LiFBLON #design
- Thermal aware design method for VCSEL-based on-chip optical interconnect (HL, AF, SLB, XL, IO, GN), pp. 1120–1125.
- DATE-2014-FourmigueBN #3d #performance #simulation
- Efficient transient thermal simulation of 3D ICs with liquid-cooling and through silicon vias (AF, GB, GN), pp. 1–6.
- DATE-2013-FourmigueBN #3d #simulation
- Explicit transient thermal simulation of liquid-cooled 3D ICs (AF, GB, GN), pp. 1385–1390.
- DATE-2011-FourmigueBNAO #3d #architecture #evaluation #multi
- Multi-granularity thermal evaluation of 3D MPSoC architectures (AF, GB, GN, EMA, IO), pp. 575–578.
- DATE-2009-FourmigueGNA #design #framework #protocol
- Co-simulation based platform for wireless protocols design explorations (AF, BG, GN, EMA), pp. 874–877.