Travelled to:
1 × Germany
Collaborated with:
W.Liu T.Wang
Talks about:
manufactur (1) interpos (1) consider (1) silicon (1) routabl (1) metal (1) layer (1) plan (1) cost (1)
Person: Tzu-Kai Chien
DBLP: Chien:Tzu=Kai
Contributed to:
Wrote 1 papers:
- DATE-2014-LiuCW
- Metal layer planning for silicon interposers with consideration of routability and manufacturing cost (WHL, TKC, TCW), pp. 1–6.