Travelled to:
1 × USA
Collaborated with:
X.Zhang D.Forte M.Tehranipoor
Talks about:
structur (1) recycl (1) combat (1) cost (1) chip (1) low (1) die (1)
Person: Ujjwal Guin
DBLP: Guin:Ujjwal
Contributed to:
Wrote 1 papers:
- DAC-2014-GuinZFT #low cost
- Low-cost On-Chip Structures for Combating Die and IC Recycling (UG, XZ, DF, MT), p. 6.