M. Inui, Y. Ebina, T. Maezaki, L. Zhou
Geometric Simulation of Infeed Grinding Process of Silicon Wafer Using GPU
CASE, 2018.
@inproceedings{CASE-2018-InuiEMZ, author = "M. Inui and Y. Ebina and T. Maezaki and L. Zhou", booktitle = "{Proceedings of the 14th International Conference on Automation Science and Engineering}", doi = "10.1109/COASE.2018.8560519", isbn = "978-1-5386-3593-3", pages = "1519--1524", publisher = "{IEEE}", title = "{Geometric Simulation of Infeed Grinding Process of Silicon Wafer Using GPU}", year = 2018, }