Geometric Simulation of Infeed Grinding Process of Silicon Wafer Using GPU
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M. Inui, Y. Ebina, T. Maezaki, L. Zhou
Geometric Simulation of Infeed Grinding Process of Silicon Wafer Using GPU
CASE, 2018.

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@inproceedings{CASE-2018-InuiEMZ,
	author        = "M. Inui and Y. Ebina and T. Maezaki and L. Zhou",
	booktitle     = "{Proceedings of the 14th International Conference on Automation Science and Engineering}",
	doi           = "10.1109/COASE.2018.8560519",
	isbn          = "978-1-5386-3593-3",
	pages         = "1519--1524",
	publisher     = "{IEEE}",
	title         = "{Geometric Simulation of Infeed Grinding Process of Silicon Wafer Using GPU}",
	year          = 2018,
}

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