Direct matrix solution of linear complexity for surface integral-equation based impedance extraction of high bandwidth interconnects
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Wenwen Chai, Dan Jiao
Direct matrix solution of linear complexity for surface integral-equation based impedance extraction of high bandwidth interconnects
DAC, 2011.

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@inproceedings{DAC-2011-ChaiJ,
	author        = "Wenwen Chai and Dan Jiao",
	booktitle     = "{Proceedings of the 48th Design Automation Conference}",
	doi           = "10.1145/2024724.2024770",
	isbn          = "978-1-4503-0636-2",
	pages         = "206--211",
	publisher     = "{ACM}",
	title         = "{Direct matrix solution of linear complexity for surface integral-equation based impedance extraction of high bandwidth interconnects}",
	year          = 2011,
}

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