Xiaodong Liu, Yifan Zhang, Gary K. Yeap, Xuan Zeng
An integrated algorithm for 3D-IC TSV assignment
DAC, 2011.
@inproceedings{DAC-2011-LiuZYZ, author = "Xiaodong Liu and Yifan Zhang and Gary K. Yeap and Xuan Zeng", booktitle = "{Proceedings of the 48th Design Automation Conference}", doi = "10.1145/2024724.2024873", isbn = "978-1-4503-0636-2", pages = "652--657", publisher = "{ACM}", title = "{An integrated algorithm for 3D-IC TSV assignment}", year = 2011, }