Travelled to:2 × USA
Collaborated with:X.Liu Y.Zhang X.Zeng C.Chu J.Sun
Talks about:assign (2) algorithm (1) integr (1) global (1) design (1) track (1) rout (1) flip (1) chip (1) tsv (1)
Person: Gary K. Yeap
DBLP: Yeap:Gary_K=
Contributed to:
20112010Wrote 2 papers:
- DAC-2011-LiuZYZ #3d #algorithm
- An integrated algorithm for 3D-IC TSV assignment (XL, YZ, GKY, XZ), pp. 652–657.
- DAC-2010-LiuZYCSZ #design
- Global routing and track assignment for flip-chip designs (XL, YZ, GKY, CC, JS, XZ), pp. 90–93.