Fangming Ye, Krishnendu Chakrabarty
TSV open defects in 3D integrated circuits: characterization, test, and optimal spare allocation
DAC, 2012.
@inproceedings{DAC-2012-YeC, author = "Fangming Ye and Krishnendu Chakrabarty", booktitle = "{Proceedings of the 49th Annual Design Automation Conference}", doi = "10.1145/2228360.2228545", isbn = "978-1-4503-1199-1", pages = "1024--1030", publisher = "{ACM}", title = "{TSV open defects in 3D integrated circuits: characterization, test, and optimal spare allocation}", year = 2012, }