Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs
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Xin Zhao, Michael Scheuermann, Sung Kyu Lim
Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs
DAC, 2012.

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@inproceedings{DAC-2012-ZhaoSL,
	author        = "Xin Zhao and Michael Scheuermann and Sung Kyu Lim",
	booktitle     = "{Proceedings of the 49th Annual Design Automation Conference}",
	doi           = "10.1145/2228360.2228391",
	isbn          = "978-1-4503-1199-1",
	pages         = "157--162",
	publisher     = "{ACM}",
	title         = "{Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs}",
	year          = 2012,
}

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