An accurate semi-analytical framework for full-chip TSV-induced stress modeling
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Yang Li, David Z. Pan
An accurate semi-analytical framework for full-chip TSV-induced stress modeling
DAC, 2013.

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@inproceedings{DAC-2013-LiP,
	author        = "Yang Li and David Z. Pan",
	booktitle     = "{Proceedings of the 50th Annual Design Automation Conference}",
	doi           = "10.1145/2463209.2488957",
	isbn          = "978-1-4503-2071-9",
	pages         = "8",
	publisher     = "{ACM}",
	title         = "{An accurate semi-analytical framework for full-chip TSV-induced stress modeling}",
	year          = 2013,
}

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