3D floorplanning with thermal vias
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Eric Wong, Sung Kyu Lim
3D floorplanning with thermal vias
DATE, 2006.

DATE 2006
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@inproceedings{DATE-2006-WongL,
	author        = "Eric Wong and Sung Kyu Lim",
	booktitle     = "{Proceedings of the 10th Conference on Design, Automation and Test in Europe}",
	doi           = "10.1145/1131730",
	pages         = "878--883",
	publisher     = "{European Design and Automation Association, Leuven, Belgium}",
	title         = "{3D floorplanning with thermal vias}",
	year          = 2006,
}

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