Stem thermal$ (all stems)

178 papers:

CASE-2015-FarhanPWL #algorithm #machine learning #predict #using

Predicting individual thermal comfort using machine learning algorithms (AAF, KRP, BW, PBL), pp. 708–713.

CASE-2015-ZhaoCWCJZ #assessment

Experimental assessment of a satisfaction based thermal comfort control for a group of occupants (QZ, ZC, FW, ZC, YJ, ZZ), pp. 15–20.

DAC-2015-KhdrPSH #resource management

Thermal constrained resource management for mixed ILP-TLP workloads in dark silicon chips (HK, SP, MS, JH), p. 6.

DATE-2015-IqtedarHSH #analysis #distributed #probability

Formal probabilistic analysis of distributed dynamic thermal management (SI, OH, MS, JH), pp. 1221–1224.

DATE-2015-KamalIAP #algorithm

A thermal stress-aware algorithm for power and temperature management of MPSoCs (MK, AI, AAK, MP), pp. 954–959.

DATE-2015-KimKKC #manycore #mobile #named

M-DTM: migration-based dynamic thermal management for heterogeneous mobile multi-core processors (YGK, MK, JMK, SWC), pp. 1533–1538.

DATE-2015-LiaoWC #3d #manycore #online

An online thermal-constrained task scheduler for 3D multi-core processors (CHL, CHPW, KC), pp. 351–356.

DATE-2015-LiFBLON #design

Thermal aware design method for VCSEL-based on-chip optical interconnect (HL, AF, SLB, XL, IO, GN), pp. 1120–1125.

DATE-2015-PaganiCSH #modelling #named #performance

MatEx: efficient transient and peak temperature computation for compact thermal models (SP, JJC, MS, JH), pp. 1515–1520.

DATE-2015-PaganoVRCSS #configuration management

Thermal-aware floorplanning for partially-reconfigurable FPGA-based systems (DP, MV, MR, RC, DS, MDS), pp. 920–923.

DATE-2015-RaiT #manycore #modelling

A calibration based thermal modeling technique for complex multicore systems (DR, LT), pp. 1138–1143.

DATE-2015-SinglaKUO #mobile #power management #predict

Predictive dynamic thermal and power management for heterogeneous mobile platforms (GS, GK, AKU, ÜYO), pp. 960–965.

SIGMOD-2015-TauheedHA #named #scalability

THERMAL-JOIN: A Scalable Spatial Join for Dynamic Workloads (FT, TH, AA), pp. 939–950.

CHI-2015-AbdelrahmanSH0 #interactive

Investigation of Material Properties for Thermal Imaging-Based Interaction (YA, ASS, NH, AS), pp. 15–18.

CHI-2015-WilsonDB #feedback #interactive

In the Heat of the Moment: Subjective Interpretations of Thermal Feedback During Interaction (GW, GD, SAB), pp. 2063–2072.

HIMI-IKD-2015-KotaniIAS #interface #using #variability

Changes in Heart Rate Variability by Using Tactile Thermal Interface Device (KK, SI, TA, SS), pp. 405–411.

SAC-2015-HamataniUH #smarttech #using

Estimating core body temperature based on human thermal model using wearable sensors (TH, AU, TH), pp. 521–526.

CASE-2014-HajovskyPOH #energy #mining

Heat energy collection from thermally active mining dump Hedvika (RH, MP, SO, JH), pp. 44–49.

CASE-2014-NodaMNKOI #behaviour #maintenance #online #predict

Online maintaining behavior of high-load and unstable postures based on whole-body load balancing strategy with thermal prediction (SN, MM, SN, YK, KO, MI), pp. 1166–1171.

CASE-2014-WangC #coordination

Coordination mechanisms for planning of hydro-thermal subsystem (JW, XC), pp. 345–350.

CASE-2014-ZhaoCWJD #case study

Experimental study of group thermal comfort model (QZ, ZC, FW, YJ, JD), pp. 1075–1078.

DAC-2014-0001SMAKV #manycore #optimisation

Reinforcement Learning-Based Inter- and Intra-Application Thermal Optimization for Lifetime Improvement of Multicore Systems (AD, RAS, GVM, BMAH, AK, BV), p. 6.

DAC-2014-HuXMCHX #thread

Thermal-Sustainable Power Budgeting for Dynamic Threading (XH, YX, JM, GC, YH, YX), p. 6.

DAC-2014-Kose #challenge

Thermal Implications of On-Chip Voltage Regulation: Upcoming Challenges and Possible Solutions (SK), p. 6.

DAC-2014-SamalPSSDL #3d #modelling #optimisation #performance

Fast and Accurate Thermal Modeling and Optimization for Monolithic 3D ICs (SKS, SP, KS, MS, YD, SKL), p. 6.

DATE-2014-BartoliniCCTB #energy

Unveiling Eurora — Thermal and power characterization of the most energy-efficient supercomputer in the world (AB, MC, CC, GT, LB), pp. 1–6.

DATE-2014-BeneventiBVDB #analysis #identification #logic

Thermal analysis and model identification techniques for a logic + WIDEIO stacked DRAM test chip (FB, AB, PV, DD, LB), pp. 1–4.

DATE-2014-ChienYHLC #analysis #geometry #image

Package geometric aware thermal analysis by infrared-radiation thermal images (JHC, HY, RSH, HJL, SCC), pp. 1–4.

DATE-2014-FourmigueBN #3d #performance #simulation

Efficient transient thermal simulation of 3D ICs with liquid-cooling and through silicon vias (AF, GB, GN), pp. 1–6.

DATE-2014-KhdrESAH #multi #named

mDTM: Multi-objective dynamic thermal management for on-chip systems (HK, TE, MS, HA, JH), pp. 1–6.

DATE-2014-KumarYBT #distributed #effectiveness #named

COOLIP: Simple yet effective job allocation for distributed thermally-throttled processors (PK, HY, IB, LT), pp. 1–4.

DATE-2014-PalominoSASH #named #performance #video

hevcDTM: Application-driven Dynamic Thermal Management for High Efficiency Video Coding (DP, MS, HA, AAS, JH), pp. 1–4.

DATE-2014-PaternaZR #component #mobile

Ambient variation-tolerant and inter components aware thermal management for mobile system on chips (FP, JZ, TSR), pp. 1–6.

DATE-2014-SarmaD #estimation #network #runtime

Minimal sparse observability of complex networks: Application to MPSoC sensor placement and run-time thermal estimation & tracking (SS, ND), pp. 1–6.

DATE-2014-SassolasSGAVBFP #architecture #design #evaluation

Early design stage thermal evaluation and mitigation: The locomotiv architectural case (TS, CS, AG, AA, PV, HB, LF, NP), pp. 1–2.

DATE-2014-ShinPM #architecture #hybrid #using

Thermal management of batteries using a hybrid supercapacitor architecture (DS, MP, EM), pp. 1–6.

DATE-2014-WuWDHYY #in memory #integration #manycore #memory management

A thermal resilient integration of many-core microprocessors and main memory by 2.5D TSI I/Os (SSW, KW, SMPD, TYH, MY, HY), pp. 1–4.

DATE-2014-YuSH #adaptation #scalability

Thermal-aware frequency scaling for adaptive workloads on heterogeneous MPSoCs (HY, RS, YH), pp. 1–6.

DATE-2014-ZhangAJC #manycore #network

Thermal management of manycore systems with silicon-photonic networks (TZ, JLA, AJ, AKC), pp. 1–6.

CHI-2014-ShiraziAHSKS #interactive

Exploiting thermal reflection for interactive systems (ASS, YA, NH, SS, MK, AS), pp. 3483–3492.

DHM-2014-LiZYD #simulation

Simulation on Thermal Control System of the Extravehicular Spacesuit (TL, JZ, XY, LD), pp. 112–123.

HIMI-DE-2014-SakaguchiIH #development #performance #using

Development of High-Speed Thermal Display Using Water Flow (MS, KI, KH), pp. 233–240.

SAC-2014-TsaiC #3d #manycore

A thermal-throttling server in 3D multicore chips (THT, YSC), pp. 1425–1430.

SAC-2014-ZanattaBGL #component #framework #monitoring #off the shelf

Building a WSN infrastructure with COTS components for the thermal monitoring of datacenters (GZ, GDB, RG, JCBL), pp. 1443–1448.

HPCA-2014-ZhengMW #energy

Exploiting thermal energy storage to reduce data center capital and operating expenses (WZ, KM, XW), pp. 132–141.

CASE-2013-LiYY #energy #novel #performance

A novel parabolic trough solar lighting and thermal system for building energy efficiency (TL, FY, CY), pp. 657–662.

CASE-2013-RoyerBTT #assessment #behaviour #energy #modelling #multi #simulation #using

Modelling of a multi-zone building and assessment of its thermal behaviour using an energy simulation software (SR, MB, ST, TT), pp. 735–740.

CASE-2013-ZhaoZXCWS #framework

A unified control framework of HVAC system for thermal and acoustic comforts in office building (YZ, QZ, LX, ZC, FW, FS), pp. 416–421.

DAC-2013-DevWR #3d #integration #testing #using

High-throughput TSV testing and characterization for 3D integration using thermal mapping (KD, GW, SR), p. 6.

DATE-2013-BouhadibaMM #energy #modelling #validation

System-level modeling of energy in TLM for early validation of power and thermal management (TB, MM, FM), pp. 1609–1614.

DATE-2013-DaloukasMETS #approach #network #parallel #performance #power management

A parallel fast transform-based preconditioning approach for electrical-thermal co-simulation of power delivery networks (KD, AM, NEE, PT, GIS), pp. 1689–1694.

DATE-2013-DiversiBTBB #identification

SCC thermal model identification via advanced bias-compensated least-squares (RD, AB, AT, FB, LB), pp. 230–235.

DATE-2013-ElfadelMA #formal method #industrial #manycore

Closed-loop control for power and thermal management in multi-core processors: formal methods and industrial practice (IME, RM, DA), pp. 1879–1881.

DATE-2013-FourmigueBN #3d #simulation

Explicit transient thermal simulation of liquid-cooled 3D ICs (AF, GB, GN), pp. 1385–1390.

DATE-2013-LeeWHY #3d #hybrid #named

NUMANA: a hybrid numerical and analytical thermal simulator for 3-D ICs (YML, THW, PYH, CPY), pp. 1379–1384.

DATE-2013-WangTSL #algorithm

A power-driven thermal sensor placement algorithm for dynamic thermal management (HW, SXDT, SS, XL), pp. 1215–1220.

DATE-2013-XieYPSC #adaptation

Adaptive thermal management for portable system batteries by forced convection cooling (QX, SY, MP, DS, NC), pp. 1225–1228.

DATE-2013-XydisPS #configuration management

Thermal-aware datapath merging for coarse-grained reconfigurable processors (SX, GP, CS), pp. 1649–1654.

DATE-2013-ZhaoLBT #detection #manycore #probability #runtime

Run-time probabilistic detection of miscalibrated thermal sensors in many-core systems (JZ, S(L, WB, RT), pp. 1395–1398.

DUXU-NTE-2013-Lam #interactive #using

Creating Instantly Disappearing Prints Using Thermochromic Paint and Thermal Printer in an Interactive Art Installation (MLL), pp. 290–295.

CASE-2012-Ralston #automation #using

Automated longwall shearer horizon control using thermal infrared-based seam tracking (JCR), pp. 20–25.

DAC-2012-AthikulwongsePL #3d

Exploiting die-to-die thermal coupling in 3D IC placement (KA, MP, SKL), pp. 741–746.

DAC-2012-MengKC #3d #constraints #energy #manycore #optimisation #performance

Optimizing energy efficiency of 3-D multicore systems with stacked DRAM under power and thermal constraints (JM, KK, AKC), pp. 648–655.

DAC-2012-RanieriVCAV #algorithm #manycore #named

EigenMaps: algorithms for optimal thermal maps extraction and sensor placement on multicore processors (JR, AV, AC, DA, MV), pp. 636–641.

DAC-2012-ZhouLCKQY #framework #monitoring

An information-theoretic framework for optimal temperature sensor allocation and full-chip thermal monitoring (HZ, XL, CYC, EK, HQ, SCY), pp. 642–647.

DATE-2012-JuanCMC #modelling #optimisation #power management #statistics

Statistical thermal modeling and optimization considering leakage power variations (DCJ, YLC, DM, YWC), pp. 605–610.

DATE-2012-LiuFQ #framework #manycore

Neighbor-aware dynamic thermal management for multi-core platform (GL, MF, GQ), pp. 187–192.

DATE-2012-SabrySA #3d #using

Thermal balancing of liquid-cooled 3D-MPSoCs using channel modulation (MMS, AS, DA), pp. 599–604.

CHI-2012-HalveyWBH #feedback #quote

“Baby it’s cold outside”: the influence of ambient temperature and humidity on thermal feedback (MH, GW, SAB, SAH), pp. 715–724.

ICPR-2012-LiuW #image

Posed and spontaneous expression distinguishment from infrared thermal images (ZL, SW), pp. 1108–1111.

ICPR-2012-SunD #recognition #sketching

Sketch-based face alignment for thermal face recognition (LS, XXD), pp. 2347–2350.

SAC-2012-TsaiC #3d #manycore #realtime #scheduling

Thermal-aware real-time task scheduling for three-dimensional multicore chip (THT, YSC), pp. 1618–1624.

HPCA-2012-AyoubNR #cpu #energy #memory management #named

JETC: Joint energy thermal and cooling management for memory and CPU subsystems in servers (RZA, RN, TR), pp. 299–310.

DAC-2011-BailisRGBS #injection #named

Dimetrodon: processor-level preventive thermal management via idle cycle injection (PB, VJR, SG, DMB, MIS), pp. 89–94.

DAC-2011-CongLS #3d

Thermal-aware cell and through-silicon-via co-placement for 3D ICs (JC, GL, YS), pp. 670–675.

DAC-2011-GeQ #machine learning #multi #using

Dynamic thermal management for multimedia applications using machine learning (YG, QQ), pp. 95–100.

DAC-2011-HochmanBW #empirical #reduction

A stabilized discrete empirical interpolation method for model reduction of electrical, thermal, and microelectromechanical systems (AH, BNB, JKW), pp. 540–545.

DAC-2011-KumarT #realtime

Cool shapers: shaping real-time tasks for improved thermal guarantees (PK, LT), pp. 468–473.

DAC-2011-KungHSS #optimisation

Thermal signature: a simple yet accurate thermal index for floorplan optimization (JK, IH, SSS, YS), pp. 108–113.

DAC-2011-ThieleSYB #analysis #embedded #multi #synthesis

Thermal-aware system analysis and software synthesis for embedded multi-processors (LT, LS, HY, IB), pp. 268–273.

DATE-2011-BartoliniCTB #distributed #energy #multi #predict #self

A distributed and self-calibrating model-predictive controller for energy and thermal management of high-performance multicores (AB, MC, AT, LB), pp. 830–835.

DATE-2011-FourmigueBNAO #3d #architecture #evaluation #multi

Multi-granularity thermal evaluation of 3D MPSoC architectures (AF, GB, GN, EMA, IO), pp. 575–578.

DATE-2011-HameedFH #3d #adaptation #architecture #manycore #runtime

Dynamic thermal management in 3D multi-core architecture through run-time adaptation (FH, MAAF, JH), pp. 299–304.

DATE-2011-HanumaiahV #manycore #realtime

Reliability-aware thermal management for hard real-time applications on multi-core processors (VH, SBKV), pp. 137–142.

DATE-2011-JuanGM #3d #evaluation #multi #process #statistics

Statistical thermal evaluation and mitigation techniques for 3D Chip-Multiprocessors in the presence of process variations (DCJ, SG, DM), pp. 383–388.

DATE-2011-LungHKC #3d #manycore #online #optimisation #throughput

Thermal-aware on-line task allocation for 3D multi-core processor throughput optimization (CLL, YLH, DMK, SCC), pp. 8–13.

DATE-2011-SabrySATLSBTBM #3d #design #towards

Towards thermally-aware design of 3D MPSoCs with inter-tier cooling (MMS, AS, DA, YT, YL, SS, NB, JRT, TB, BM), pp. 1466–1471.

DATE-2011-XuPM

Analytical heat transfer model for thermal through-silicon vias (HX, VFP, GDM), pp. 395–400.

DATE-2011-ZhangHYG #case study #interface #reliability

Case study: Alleviating hotspots and improving chip reliability via carbon nanotube thermal interface (WZ, JH, SY, PG), pp. 1071–1076.

CHI-2011-LarsonCGRHFP #interactive #named

HeatWave: thermal imaging for surface user interaction (ECL, GC, SG, XR, BLH, DF, SP), pp. 2565–2574.

CHI-2011-WilsonHBH #feedback #mobile

Some like it hot: thermal feedback for mobile devices (GW, MH, SAB, SAH), pp. 2555–2564.

DHM-2011-ShenY #assessment

The Application of the Human Model in the Thermal Comfort Assessment of Fighter Plane’s Cockpit (HS, XY), pp. 357–366.

ICEIS-v2-2011-GuLZBWC #assessment #enterprise #information management #safety

A Case-based Enterprise Information System for Thermal Power Plants’ Safety Assessment (DxG, CyL, CrZ, IB, JW, WeC), pp. 32–39.

HPCA-2011-LiuLNMMH #hardware

Hardware/software techniques for DRAM thermal management (SL, BL, AN, SOM, GM, NH), pp. 515–525.

CASE-2010-HewlettK #simulation

Dynamic simulation of ship-system thermal load management (PTH, TMK), pp. 734–741.

CASE-2010-HolsonbackK #aspect-oriented

Thermal aspects of a shipboard integrated electric power system (CRH, TMK), pp. 742–749.

CASE-2010-QiC #constraints #optimisation #probability

Stochastic optimization of hydro-thermal system with annual water consumption constraints (YQ, XC), pp. 1001–1006.

CASE-2010-TahersimaSRN #analysis

Thermal analysis of an HVAC system with TRV controlled hydronic radiator (FT, JS, HR, PGN), pp. 756–761.

CASE-2010-ZhangWPTCPJ #analysis

Micro-thermal-fluid transient analysis and active control for two-phase microelectronics cooling (TZ, JTW, YP, TT, JYC, RP, MKJ), pp. 750–755.

DAC-2010-CochranR #consistency #detection #predict #runtime

Consistent runtime thermal prediction and control through workload phase detection (RC, SR), pp. 62–67.

DAC-2010-GeMQ #distributed #manycore #migration

Distributed task migration for thermal management in many-core systems (YG, PM, QQ), pp. 579–584.

DAC-2010-NowrozCR #monitoring

Thermal monitoring of real processors: techniques for sensor allocation and full characterization (ANN, RC, SR), pp. 56–61.

DAC-2010-ZhangC #embedded

Thermal aware task sequencing on embedded processors (SZ, KSC), pp. 585–590.

DAC-2010-ZhangS #adaptation #performance

Adaptive and autonomous thermal tracking for high performance computing systems (YZ, AS), pp. 68–73.

DATE-2010-ChenDS #algorithm #analysis

Properties of and improvements to time-domain dynamic thermal analysis algorithms (XC, RPD, LS), pp. 1165–1170.

DATE-2010-EguiaTSPT #behaviour #design #manycore #modelling

General behavioral thermal modeling and characterization for multi-core microprocessor design (TJAE, SXDT, RS, EHP, MT), pp. 1136–1141.

DATE-2010-LongM #bias #monitoring #network #optimisation

Optimization of the bias current network for accurate on-chip thermal monitoring (JL, SOM), pp. 1365–1368.

DATE-2010-YuZQB #behaviour #design #power management

Behavioral level dual-vth design for reduced leakage power with thermal awareness (JY, QZ, GQ, JB), pp. 1261–1266.

ASPLOS-2010-Mesa-MartinezAR #behaviour

Characterizing processor thermal behavior (FJMM, EKA, JR), pp. 193–204.

HPDC-2010-AbbasiVG #internet

Thermal aware server provisioning and workload distribution for internet data centers (ZA, GV, SKSG), pp. 130–141.

DAC-2009-AyalaAB #analysis #data flow

Thermal-aware data flow analysis (JLA, DA, PB), pp. 613–614.

DAC-2009-BaoAEP #dependence #energy #online #optimisation #scalability

On-line thermal aware dynamic voltage scaling for energy optimization with frequency/temperature dependency consideration (MB, AA, PE, ZP), pp. 490–495.

DAC-2009-CochranR

Spectral techniques for high-resolution thermal characterization with limited sensor data (RC, SR), pp. 478–483.

DAC-2009-HanumaiahRVC #constraints #manycore #throughput

Throughput optimal task allocation under thermal constraints for multi-core processors (VH, RR, SBKV, KSC), pp. 776–781.

DAC-2009-JayaseelanM #adaptation #architecture

Dynamic thermal management via architectural adaptation (RJ, TM), pp. 484–489.

DAC-2009-LeeK #manycore #optimisation #throughput #using

Optimizing throughput of power- and thermal-constrained multicore processors using DVFS and per-core power-gating (JL, NSK), pp. 47–50.

DAC-2009-LinZWC

Thermal-driven analog placement considering device matching (MPHL, HZ, MDFW, YWC), pp. 593–598.

DAC-2009-YeLCC #analysis #layout #process #variability

Variability analysis under layout pattern-dependent rapid-thermal annealing process (YY, FL, MC, YC), pp. 551–556.

DAC-2009-ZhangS #estimation #using

Accurate temperature estimation using noisy thermal sensors (YZ, AS), pp. 472–477.

DATE-2009-CoskunAARL #3d #architecture #manycore

Dynamic thermal management in 3D multicore architectures (AKC, JLA, DA, TSR, YL), pp. 1410–1415.

DATE-2009-HanumaiahVC #constraints #manycore #performance

Performance optimal speed control of multi-core processors under thermal constraints (VH, SBKV, KSC), pp. 1548–1551.

DATE-2009-HsiehH #3d #design #memory management

Thermal-aware memory mapping in 3D designs (ACH, TH), pp. 1361–1366.

DATE-2009-KhanK09a #architecture #co-evolution #design #hardware #multi

Hardware/software co-design architecture for thermal management of chip multiprocessors (OK, SK), pp. 952–957.

DATE-2009-LeeKHBJFL #3d #co-evolution #design #network

Co-design of signal, power, and thermal distribution networks for 3D ICs (YJL, YJK, GH, MSB, YKJ, AGF, SKL), pp. 610–615.

DATE-2009-WangHZC #design

Exploiting narrow-width values for thermal-aware register file designs (SW, JSH, SGZ, SWC), pp. 1422–1427.

DATE-2009-WangM #using

An accurate interconnect thermal model using equivalent transmission line circuit (BW, PM), pp. 280–283.

DATE-2009-YeoK #behaviour #manycore

Temperature-aware scheduler based on thermal behavior grouping in multicore systems (IY, EJK), pp. 946–951.

HCI-NIMT-2009-IizukaY #case study

Experimental Study about Effect of Thermal Information Presentation to Mouse (SI, SY), pp. 444–450.

DAC-2008-HuangSSRS #design #manycore #perspective

Many-core design from a thermal perspective (WH, MRS, KS, RJR, KS), pp. 746–749.

DAC-2008-JungRP #manycore #modelling #probability

Stochastic modeling of a thermally-managed multi-core system (HJ, PR, MP), pp. 728–733.

DAC-2008-PuriVEWFYK #problem #question

Keeping hot chips cool: are IC thermal problems hot air? (RP, DV, DE, AJW, PDF, AY, SVK), pp. 634–635.

DAC-2008-YeoLK #manycore #predict

Predictive dynamic thermal management for multicore systems (IY, CCL, EJK), pp. 734–739.

DATE-2008-MulasPBCABAM #architecture #multi #policy #streaming

Thermal Balancing Policy for Streaming Computing on Multiprocessor Architectures (FM, MP, MB, SC, AA, LB, DA, GDM), pp. 734–739.

HPCA-2008-RamosB #named #predict

C-Oracle: Predictive thermal management for data centers (LER, RB), pp. 111–122.

CASE-2007-ZhouGWJFLU #precise

Active Thermal Management for Precision Positioning (RZ, WG, JTW, MKJ, JF, GL, MU), pp. 45–50.

DAC-2007-GoplenS #3d

Placement of 3D ICs with Thermal and Interlayer Via Considerations (BG, SSS), pp. 626–631.

DAC-2007-SundaresanM #analysis #distributed

An Analysis of Timing Violations Due to Spatially Distributed Thermal Effects in Global Wires (KS, NRM), pp. 515–520.

DATE-2007-MondalRKRLVM #3d #robust

Thermally robust clocking schemes for 3D integrated circuits (MM, AJR, SK, TR, GML, NV, YM), pp. 1206–1211.

HPCA-2007-ChoiKSSWL #modelling

Modeling and Managing Thermal Profiles of Rack-mounted Servers with ThermoStat (JC, YK, AS, JS, QW, JL), pp. 205–215.

HPCA-2007-PuttaswamyL #3d #architecture

Thermal Herding: Microarchitecture Techniques for Controlling Hotspots in High-Performance 3D-Integrated Processors (KP, GHL), pp. 193–204.

DAC-2006-AtienzaVPPBMM #framework #multi #performance

A fast HW/SW FPGA-based thermal emulation framework for multi-processor system-on-chip (DA, PGDV, GP, FP, LB, GDM, JMM), pp. 618–623.

DAC-2006-KumarSPJ #approach #coordination #named

HybDTM: a coordinated hardware-software approach for dynamic thermal management (AK, LS, LSP, NKJ), pp. 548–553.

DAC-2006-LoiASLSB #3d #analysis #performance

A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy (GLL, BA, NS, SCL, TS, KB), pp. 991–996.

DATE-2006-BhanjaOLP #design #novel #robust

Novel designs for thermally robust coplanar crossing in QCA (SB, MO, FL, SP), pp. 786–791.

DATE-2006-ChakrabortySDMMP #bound #optimisation

Thermal resilient bounded-skew clock tree optimization methodology (AC, PS, KD, AM, EM, MP), pp. 832–837.

DATE-2006-HealyVEBLLL #architecture #performance #trade-off

Microarchitectural floorplanning under performance and thermal tradeoff (MBH, MV, ME, CSB, SKL, HHSL, GHL), pp. 1288–1293.

DATE-2006-LiuI #optimisation #scheduling #using

Test scheduling with thermal optimization for network-on-chip systems using variable-rate on-chip clocking (CL, VI), pp. 652–657.

DATE-2006-WangM #algorithm #analysis #multi

A logarithmic full-chip thermal analysis algorithm based on multi-layer Green’s function (BW, PM), pp. 39–44.

DATE-2006-WangXVI #analysis #optimisation

On-chip bus thermal analysis and optimization (FW, YX, NV, MJI), pp. 850–855.

DATE-2006-WongL #3d

3D floorplanning with thermal vias (EW, SKL), pp. 878–883.

DATE-2006-YangGZSD #adaptation #analysis #design #synthesis

Adaptive chip-package thermal analysis for synthesis and design (YY, Z(G, CZ, LS, RPD), pp. 844–849.

ICPR-v3-2006-CharoentamPJ #image #multi #problem #robust

A Robust Region-Based Multiscale Image Fusion Scheme for Mis-Registration Problem of Thermal and Visible Images (OC, VP, SJ), pp. 669–672.

LCTES-2006-MutyamLNKI #functional

Compiler-directed thermal management for VLIW functional units (MM, FL, NV, MTK, MJI), pp. 163–172.

CASE-2005-NgYHD #energy #process

Diagnosis of sheet metal stamping processes based on thermal energy distribution (YMHN, MY, YH, RD), pp. 191–196.

DATE-2005-BotaRRS #testing

Smart Temperature Sensor for Thermal Testing of Cell-Based ICs (SAB, MR, JLR, JS), pp. 464–465.

DATE-2005-HungXVKI #embedded #scheduling

Thermal-Aware Task Allocation and Scheduling for Embedded Systems (WLH, YX, NV, MTK, MJI), pp. 898–899.

DATE-2005-RosingerAC #agile #generative

Rapid Generation of Thermal-Safe Test Schedules (PMR, BMAH, KC), pp. 840–845.

DATE-2005-RosselloCBKS #concurrent #performance

A Fast Concurrent Power-Thermal Model for Sub-100nm Digital ICs (JLR, VC, SAB, AK, JS), pp. 206–211.

HPCA-2005-LiBHS #architecture #energy #performance #smt

Performance, Energy, and Thermal Considerations for SMT and CMP Architectures (YL, DMB, ZH, KS), pp. 71–82.

HPCA-2005-SundaresanM #energy #modelling

Accurate Energy Dissipation and Thermal Modeling for Nanometer-Scale Buses (KS, NRM), pp. 51–60.

DAC-2004-HuangSSSGV #design #modelling

Compact thermal modeling for temperature-aware design (WH, MRS, KS, KS, SG, SV), pp. 878–883.

DATE-v1-2004-Skadron #architecture #hybrid

Hybrid Architectural Dynamic Thermal Management (KS), pp. 10–15.

DATE-v2-2004-WangTC #network #optimisation

Thermal and Power Integrity Based Power/Ground Networks Optimization (TYW, JLT, CCPC), pp. 830–835.

ICPR-v4-2004-DavisS #detection #people #robust

Robust Detection of People in Thermal Imagery (JWD, VS), pp. 713–716.

ICPR-v4-2004-FanL #image #using #verification

The Using of Thermal Images of Palm-dorsa Vein-patterns for Biometric Verification (KCF, CLL), pp. 450–453.

ICPR-v4-2004-SocolinskyS #recognition

Thermal Face Recognition Over Time (DAS, AS), pp. 187–190.

SAC-2004-ZhouLA #bound #image

Boundary extraction in thermal images by edge map (QZ, ZL, JKA), pp. 254–258.

DATE-2003-RenczSP #algorithm #layout #performance #simulation

A Fast Algorithm for the Layout Based Electro-Thermal Simulation (MR, VS, AP), pp. 11032–11037.

ICPR-v4-2002-SocolinskyS #analysis #comparative #performance #recognition

A Comparative Analysis of Face Recognition Performance with Visible and Thermal Infrared Imagery (DAS, AS), p. 217–?.

HPCA-2002-SkadronAS #locality #modelling

Control-Theoretic Techniques and Thermal-RC Modeling for Accurate and Localized Dynamic Thermal Management (KS, TFA, MRS), pp. 17–28.

HPCA-2001-BrooksM

Dynamic Thermal Management for High-Performance Microprocessors (DMB, MM), pp. 171–182.

DAC-2000-TsaiK #performance #reduction #simulation

Fast temperature calculation for transient electrothermal simulation by mixed frequency/time domain thermal model reduction (CHT, SMK), pp. 750–755.

DAC-1999-BanerjeeMSH #on the

On Thermal Effects in Deep Sub-Micron VLSI Interconnects (KB, AM, ALSV, CH), pp. 885–891.

DATE-1998-SzekelyR #performance #static analysis

Fast Field Solvers for Thermal and Electrostatic Analysis (VS, MR), pp. 518–523.

EDTC-1997-SzekelyPPRC #simulation

SISSSI-A tool for dynamic electro-thermal simulation of analog VLSI cells (VS, AP, AP, MR, AC), p. 617.

DAC-1996-ChengTDRK #named #reliability

iCET: A Complete Chip-Level Thermal Reliability Diagnosis Tool for CMOS VLSI Chips (YKC, CCT, AD, ER, SMK), pp. 548–551.

ICPR-1996-GriffinKWM

Techniques for the interpretation of thermal paint coated samples (AG, JK, TW, JM), pp. 959–963.

DAC-1994-KovalFSD #named

MONSTR: A Complete Thermal Simulator of Electronic Systems (VK, IWF, AJS, SWD), pp. 570–575.