@inproceedings{DATE-2013-LefterVTEHC,
	acmid         = "2485588",
	author        = "Mihai Lefter and George Razvan Voicu and Mottaqiallah Taouil and Marius Enachescu and Said Hamdioui and Sorin Dan Cotofana",
	booktitle     = "{Proceedings of the 17th Conference on Design, Automation and Test in Europe}",
	isbn          = "978-1-4503-2153-2",
	pages         = "1251--1254",
	publisher     = "{EDA Consortium San Jose, CA, USA / ACM DL}",
	title         = "{Is TSV-based 3D integration suitable for inter-die memory repair?}",
	year          = 2013,
}