Travelled to:
1 × France
Collaborated with:
G.R.Voicu M.Taouil M.Enachescu S.Hamdioui S.D.Cotofana
Talks about:
suitabl (1) repair (1) memori (1) integr (1) inter (1) base (1) tsv (1) die (1)
Person: Mihai Lefter
DBLP: Lefter:Mihai
Contributed to:
Wrote 1 papers:
- DATE-2013-LefterVTEHC #3d #integration #memory management #question
- Is TSV-based 3D integration suitable for inter-die memory repair? (ML, GRV, MT, ME, SH, SDC), pp. 1251–1254.