@inproceedings{DATE-2013-ShihW,
	acmid         = "2485640",
	author        = "Hsiu-Chuan Shih and Cheng-Wen Wu",
	booktitle     = "{Proceedings of the 17th Conference on Design, Automation and Test in Europe}",
	isbn          = "978-1-4503-2153-2",
	pages         = "1486--1489",
	publisher     = "{EDA Consortium San Jose, CA, USA / ACM DL}",
	title         = "{An enhanced double-TSV scheme for defect tolerance in 3D-IC}",
	year          = 2013,
}