Travelled to:
1 × France
Collaborated with:
C.Wu
Talks about:
scheme (1) enhanc (1) defect (1) toler (1) doubl (1) tsv (1)
Person: Hsiu-Chuan Shih
DBLP: Shih:Hsiu=Chuan
Contributed to:
Wrote 1 papers:
- DATE-2013-ShihW #3d #fault
- An enhanced double-TSV scheme for defect tolerance in 3D-IC (HCS, CWW), pp. 1486–1489.