Fangming Ye, Krishnendu Chakrabarty
TSV open defects in 3D integrated circuits: characterization, test, and optimal spare allocation
DAC, 2012.
@inproceedings{DAC-2012-YeC,
author = "Fangming Ye and Krishnendu Chakrabarty",
booktitle = "{Proceedings of the 49th Annual Design Automation Conference}",
doi = "10.1145/2228360.2228545",
isbn = "978-1-4503-1199-1",
pages = "1024--1030",
publisher = "{ACM}",
title = "{TSV open defects in 3D integrated circuits: characterization, test, and optimal spare allocation}",
year = 2012,
}











