TSV open defects in 3D integrated circuits: characterization, test, and optimal spare allocation
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Fangming Ye, Krishnendu Chakrabarty
TSV open defects in 3D integrated circuits: characterization, test, and optimal spare allocation
DAC, 2012.

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@inproceedings{DAC-2012-YeC,
	author        = "Fangming Ye and Krishnendu Chakrabarty",
	booktitle     = "{Proceedings of the 49th Annual Design Automation Conference}",
	doi           = "10.1145/2228360.2228545",
	isbn          = "978-1-4503-1199-1",
	pages         = "1024--1030",
	publisher     = "{ACM}",
	title         = "{TSV open defects in 3D integrated circuits: characterization, test, and optimal spare allocation}",
	year          = 2012,
}

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