Travelled to:2 × USA
Collaborated with:K.Chakrabarty L.Jiang Q.Xu B.Eklow
Talks about:tsv (2) character (1) circuit (1) repair (1) integr (1) effici (1) effect (1) defect (1) stack (1) spare (1)
Person: Fangming Ye
DBLP: Ye:Fangming
Contributed to:
20132012Wrote 2 papers:
- DAC-2013-JiangYXCE #3d #effectiveness #on the #performance
- On effective and efficient in-field TSV repair for stacked 3D ICs (LJ, FY, QX, KC, BE), p. 6.
- DAC-2012-YeC #3d #fault
- TSV open defects in 3D integrated circuits: characterization, test, and optimal spare allocation (FY, KC), pp. 1024–1030.