Roshan Weerasekera, Matt Grange, Dinesh Pamunuwa, Hannu Tenhunen
On signalling over Through-Silicon Via (TSV) interconnects in 3-D Integrated Circuits
DATE, 2010.
@inproceedings{DATE-2010-WeerasekeraGPT,
author = "Roshan Weerasekera and Matt Grange and Dinesh Pamunuwa and Hannu Tenhunen",
booktitle = "{Proceedings of the 14th Conference on Design, Automation and Test in Europe}",
pages = "1325--1328",
publisher = "{IEEE}",
title = "{On signalling over Through-Silicon Via (TSV) interconnects in 3-D Integrated Circuits}",
year = 2010,
}
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