Travelled to:
1 × Germany
Collaborated with:
M.Grange D.Pamunuwa H.Tenhunen
Talks about:
interconnect (1) silicon (1) circuit (1) signal (1) integr (1) tsv (1)
Person: Roshan Weerasekera
DBLP: Weerasekera:Roshan
Contributed to:
Wrote 1 papers:
- DATE-2010-WeerasekeraGPT #3d #on the
- On signalling over Through-Silicon Via (TSV) interconnects in 3-D Integrated Circuits (RW, MG, DP, HT), pp. 1325–1328.