Travelled to:2 × Germany
Collaborated with:∅ R.Weerasekera M.Grange H.Tenhunen
Talks about:integr (2) interconnect (1) technolog (1) electron (1) silicon (1) circuit (1) signal (1) memori (1) extend (1) applic (1)
Person: Dinesh Pamunuwa
DBLP: Pamunuwa:Dinesh
Contributed to:
20102008Wrote 2 papers:
- DATE-2010-WeerasekeraGPT #3d #on the
- On signalling over Through-Silicon Via (TSV) interconnects in 3-D Integrated Circuits (RW, MG, DP, HT), pp. 1325–1328.
- DATE-2008-Pamunuwa #integration #memory management #scalability
- Memory Technology for Extended Large-Scale Integration in Future Electronics Applications (DP), pp. 1126–1127.