A chip-package-board co-design methodology
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Hsu-Chieh Lee, Yao-Wen Chang
A chip-package-board co-design methodology
DAC, 2012.

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@inproceedings{DAC-2012-LeeC,
	author        = "Hsu-Chieh Lee and Yao-Wen Chang",
	booktitle     = "{Proceedings of the 49th Annual Design Automation Conference}",
	doi           = "10.1145/2228360.2228557",
	isbn          = "978-1-4503-1199-1",
	pages         = "1082--1087",
	publisher     = "{ACM}",
	title         = "{A chip-package-board co-design methodology}",
	year          = 2012,
}

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