Duckhwan Kim, Saibal Mukhopadhyay
On the Design of Reliable 3D-ICs Considering Charged Device Model ESD Events During Die Stacking
DAC, 2014.
@inproceedings{DAC-2014-KimM,
author = "Duckhwan Kim and Saibal Mukhopadhyay",
booktitle = "{Proceedings of the 51st Annual Design Automation Conference}",
doi = "10.1145/2593069.2593168",
isbn = "978-1-4503-2730-5",
pages = "6",
publisher = "{ACM}",
title = "{On the Design of Reliable 3D-ICs Considering Charged Device Model ESD Events During Die Stacking}",
year = 2014,
}