Sih-Sian Wu, Kanwen Wang, Sai Manoj Pudukotai Dinakarrao, Tsung-Yi Ho, Mingbin Yu, Hao Yu
A thermal resilient integration of many-core microprocessors and main memory by 2.5D TSI I/Os
DATE, 2014.
@inproceedings{DATE-2014-WuWDHYY,
author = "Sih-Sian Wu and Kanwen Wang and Sai Manoj Pudukotai Dinakarrao and Tsung-Yi Ho and Mingbin Yu and Hao Yu",
booktitle = "{Proceedings of the 18th Conference and Exhibition on Design, Automation and Test in Europe}",
doi = "10.7873/DATE.2014.190",
pages = "1--4",
publisher = "{IEEE}",
title = "{A thermal resilient integration of many-core microprocessors and main memory by 2.5D TSI I/Os}",
year = 2014,
}