Travelled to:
1 × USA
Collaborated with:
M.F.Chang J.Cong A.Kaplan M.Naik G.Reinman S.Tam
Talks about:
interconnect (1) overlaid (1) network (1) multi (1) chip (1) band (1) cmp (1)
Person: Eran Socher
DBLP: Socher:Eran
Contributed to:
Wrote 1 papers:
- HPCA-2008-ChangCKNRST #multi
- CMP network-on-chip overlaid with multi-band RF-interconnect (MFC, JC, AK, MN, GR, ES, SWT), pp. 191–202.