Travelled to:
1 × USA
Collaborated with:
S.Sinha Q.Su J.Kawa C.Chiang
Talks about:
manufactur (1) variat (1) consid (1) yield (1) model (1) intra (1) die (1)
Person: Jianfeng Luo
DBLP: Luo:Jianfeng
Contributed to:
Wrote 1 papers:
- DAC-2006-LuoSSKC
- An IC manufacturing yield model considering intra-die variations (JL, SS, QS, JK, CC), pp. 749–754.