6 papers:
CHI-2012-JohnsonRLB #challenge #research- Being in the thick of in-the-wild studies: the challenges and insights of researcher participation (RMGJ, YR, JvdL, NBB), pp. 1135–1144.
CASE-2011-PurwinsNBHKLPW #predict- Regression methods for prediction of PECVD Silicon Nitride layer thickness (HP, AN, BB, UH, AK, BL, GP, KW), pp. 387–392.
ICPR-2010-CardosoR #distance #estimation #music #robust- Robust Staffline Thickness and Distance Estimation in Binary and Gray-Level Music Scores (JSC, AR), pp. 1856–1859.
TLCA-2009-Boudes #game studies- Thick Subtrees, Games and Experiments (PB), pp. 65–79.
DAC-1977-Christley #design #interactive- Thick film substrate (Micropackage) design utilizing interactive Computer Aided Design systems (FMC), pp. 450–459.
- DAC-1977-Waldvogel #hybrid #multi #using
- Computer designed multilayer hybrid substrate using thick film technology (CWW), pp. 351–353.
