Li Jiang, Fangming Ye, Qiang Xu, Krishnendu Chakrabarty, Bill Eklow
On effective and efficient in-field TSV repair for stacked 3D ICs
DAC, 2013.
@inproceedings{DAC-2013-JiangYXCE,
author = "Li Jiang and Fangming Ye and Qiang Xu and Krishnendu Chakrabarty and Bill Eklow",
booktitle = "{Proceedings of the 50th Annual Design Automation Conference}",
doi = "10.1145/2463209.2488824",
isbn = "978-1-4503-2071-9",
pages = "6",
publisher = "{ACM}",
title = "{On effective and efficient in-field TSV repair for stacked 3D ICs}",
year = 2013,
}