Travelled to:1 × Poland
4 × USA
Collaborated with:Y.Bachar R.Puri D.Varma D.Edwards A.J.Weger P.D.Franzon S.V.Kosonocky S.Bansal J.C.Rey M.Jang L.C.Lu P.Magarshack P.Marchal R.Radojcic T.Fox L.Covey S.Mack D.Heacock E.P.Huijbregts V.Johnson A.Kornfeld P.S.Zuchowski J.M.Rabaey D.Sylvester D.Blaauw K.Bernstein J.Frenkil M.Horowitz W.Nebel T.Sakurai
Talks about:power (2) hot (2) interfac (1) approach (1) thermal (1) program (1) problem (1) current (1) socket (1) should (1)
Person: Andrew Yang
DBLP: Yang:Andrew
Contributed to:
2010200820052003
1999Wrote 5 papers:
- DAC-2010-BansalRYJLMMR #3d #question
- 3-D stacked die: now or future? (SB, JCR, AY, MSJ, LCL, PM, PM, RR), pp. 298–299.
- DAC-2008-PuriVEWFYK #problem #question
- Keeping hot chips cool: are IC thermal problems hot air? (RP, DV, DE, AJW, PDF, AY, SVK), pp. 634–635.
- DAC-2005-FoxCMHHJKYZ #approach #question
- Should our power approach be current? (TF, LC, SM, DH, EPH, VJ, AK, AY, PSZ), p. 611.
- DAC-2003-RabaeySBBFHNSY
- Reshaping EDA for power (JMR, DS, DB, KB, JF, MH, WN, TS, AY), p. 15.
- ITiCSE-1999-YangB #education #interface #java #programming #using
- Using Java and the socket interface in teaching client/server programming (AY, YB), p. 206.