Travelled to:1 × France
1 × Germany
1 × USA
Collaborated with:J.A.Darringer J.Shin G.Luo C.L.Johnson R.Puri D.Varma D.Edwards P.D.Franzon A.Yang S.V.Kosonocky P.Bose A.Buyuktosunoglu M.S.Gupta M.B.Healy H.M.Jacobson I.Nair J.A.Rivers A.Vega
Talks about:chip (3) hot (2) challeng (1) thermal (1) problem (1) cockpit (1) pitfal (1) power (1) multi (1) manag (1)
Person: Alan J. Weger
DBLP: Weger:Alan_J=
Contributed to:
20122011
2008Wrote 3 papers:
- DATE-2012-BoseBDGHJNRSVW #challenge #manycore #power management
- Power management of multi-core chips: Challenges and pitfalls (PB, AB, JAD, MSG, MBH, HMJ, IN, JAR, JS, AV, AJW), pp. 977–982.
- DATE-2011-ShinDLWJ
- Early chip planning cockpit (JS, JAD, GL, AJW, CLJ), pp. 863–866.
- DAC-2008-PuriVEWFYK #problem #question
- Keeping hot chips cool: are IC thermal problems hot air? (RP, DV, DE, AJW, PDF, AY, SVK), pp. 634–635.