Travelled to:
1 × Germany
1 × USA
Collaborated with:
J.Chien R.Hsu S.Chang K.Yeh H.Yu
Talks about:
thermal (2) contactless (1) interpos (1) geometr (1) analysi (1) radiat (1) packag (1) infrar (1) stack (1) test (1)
Person: Hsueh-Ju Lin
DBLP: Lin:Hsueh=Ju
Contributed to:
Wrote 2 papers:
- DAC-2014-ChienHLYC #testing
- Contactless Stacked-die Testing for Pre-bond Interposers (JHC, RSH, HJL, KYY, SCC), p. 6.
- DATE-2014-ChienYHLC #analysis #geometry #image
- Package geometric aware thermal analysis by infrared-radiation thermal images (JHC, HY, RSH, HJL, SCC), pp. 1–4.