BibSLEIGH — Shih-Chieh

Travelled to:

11 × USA
3 × France
4 × Germany

Collaborated with:

M.Marek-Sadowska D.I.Cheng K.Cheng C.Lung K.Wu Y.Shi D.Chiou Y.Su M.Lee J.Chien R.Hsu H.Lin H.Chou W.Wen Y.Chen K.Lai C.Hsieh T.Tien T.Tsai D.Marculescu Y.Ho D.Kwai Y.Kao K.Tsai Z.Zeng C.Chou D.Juan Y.Chen D.Wang S.Chen C.Yeh C.Lin C.Huang C.Jiang C.Yeh M.Chang W.Jone N.S.Woo K.Yeh H.Yu S.Lin J.Chen J.Li S.Huang C.Lin K.Chen T.Wang W.Hon H.Lin C.Wang Y.Chen C.Huang Y.Yang C.Shen

Talks about:

effici (4) power (4) optim (4) synthesi (3) thermal (3) analysi (3) driven (3) design (3) algorithm (2) function (2)

Person: Shih-Chieh Chang

DBLP: Chang:Shih=Chieh

Contributed to:

2014

2013

2012

2011

2010

2007

2006

2004

2002

1999

1998

1995

1994

Wrote 23 papers:

DAC-2014-ChenWLWSC #design #monitoring #scalability: Critical Path Monitor Enabled Dynamic Voltage Scaling for Graceful Degradation in Sub-Threshold Designs (YGC, TW, KYL, WYW, YS, SCC), p. 6.
DAC-2014-ChienHLYC #testing: Contactless Stacked-die Testing for Pre-bond Interposers (JHC, RSH, HJL, KYY, SCC), p. 6.
DATE-2014-ChenLLSHC #3d: Yield and timing constrained spare TSV assignment for three-dimensional integrated circuits (YGC, KYL, MCL, YS, WKH, SCC), pp. 1–4.
DATE-2014-ChienYHLC #analysis #geometry #image: Package geometric aware thermal analysis by infrared-radiation thermal images (JHC, HY, RSH, HJL, SCC), pp. 1–4.
DAC-2013-LinCLWC #detection #fuzzy #novel: A novel fuzzy matching model for lithography hotspot detection (SYL, JYC, JCL, WYW, SCC), p. 6.
DATE-2012-LinWCCCHYS #analysis #functional #mutation testing #probability: A probabilistic analysis method for functional qualification under Mutation Analysis (HYL, CYW, SCC, YCC, HMC, CYH, YCY, CCS), pp. 147–152.
DATE-2012-WuLMC #approach #correlation: Mitigating lifetime underestimation: A system-level approach considering temperature variations and correlations between failure mechanisms (KCW, MCL, DM, SCC), pp. 1269–1274.
DAC-2011-LungSHSC #3d #fault tolerance #network: Fault-tolerant 3D clock network (CLL, YSS, SHH, YS, SCC), pp. 645–651.
DATE-2011-LungHKC #3d #manycore #online #optimisation #throughput: Thermal-aware on-line task allocation for 3D multi-core processor throughput optimization (CLL, YLH, DMK, SCC), pp. 8–13.
DAC-2010-KaoCTC #detection #performance: An efficient phase detector connection structure for the skew synchronization system (YCK, HMC, KTT, SCC), pp. 729–734.
DATE-2010-LungZCC #optimisation: Clock skew optimization considering complicated power modes (CLL, ZYZ, CHC, SCC), pp. 1474–1479.
DAC-2007-ChiouJCC #algorithm #fine-grained #power management: Fine-Grained Sleep Transistor Sizing Algorithm for Leakage Power Minimization (DSC, DCJ, YTC, SCC), pp. 81–86.
DAC-2007-SuWCM #design #optimisation #performance: An Efficient Mechanism for Performance Optimization of Variable-Latency Designs (YSS, DCW, SCC, MMS), pp. 976–981.
DAC-2006-ChiouCCY #power management: Timing driven power gating (DSC, SHC, SCC, CY), pp. 121–124.
DATE-DF-2006-LinHJC #optimisation #pattern matching #regular expression: Optimization of regular expression pattern matching circuits on FPGA (CHL, CTH, CPJ, SCC), pp. 12–17.
DAC-2004-ChangHW: Re-synthesis for delay variation tolerance (SCC, CTH, KCW), pp. 814–819.
DATE-2002-TienTC: Crosstalk Alleviation for Dynamic PLAs (TKT, TKT, SCC), pp. 683–687.
DAC-1999-YehCCJ #design: Gate-Level Design Exploiting Dual Supply Voltages for Power-Driven Applications (CWY, MCC, SCC, WBJ), pp. 68–71.
DAC-1998-ChangC #performance: Efficient Boolean Division and Substitution (SCC, DIC), pp. 342–347.
DAC-1995-ChangMC #algorithm #performance #set: An Efficient Algorithm for Local Don’t Care Sets Calculation (SCC, MMS, KTC), pp. 663–667.
DAC-1995-LinCCMC #logic #synthesis: Logic Synthesis for Engineering Change (CCL, KCC, SCC, MMS, KTC), pp. 647–652.
DAC-1994-ChangCWM #layout #logic #synthesis: Layout Driven Logic Synthesis for FPGAs (SCC, KTC, NSW, MMS), pp. 308–313.
EDAC-1994-ChangCM #multi: Minimizing ROBDD Size of Incompletely Specified Multiple Output Functions (SCC, DIC, MMS), pp. 620–624.