Travelled to:
1 × USA
Collaborated with:
J.Chien R.Hsu H.Lin S.Chang
Talks about:
contactless (1) interpos (1) stack (1) test (1) bond (1) pre (1) die (1)
Person: Ka-Yi Yeh
DBLP: Yeh:Ka=Yi
Contributed to:
Wrote 1 papers:
- DAC-2014-ChienHLYC #testing
- Contactless Stacked-die Testing for Pre-bond Interposers (JHC, RSH, HJL, KYY, SCC), p. 6.