Travelled to:2 × USA
Collaborated with:M.R.Meswani S.Blagodurov D.Roberts J.Slice G.H.Loh K.Bernstein P.Andry J.Cann P.G.Emma D.Greenberg W.Haensch S.J.Koester J.Magerlein R.Puri A.M.Young
Talks about:memori (2) interconnect (1) architectur (1) heterogen (1) challeng (1) approach (1) packag (1) dimens (1) design (1) third (1)
Person: Mike Ignatowski
DBLP: Ignatowski:Mike
Contributed to:
2015
2007Wrote 2 papers:
- HPCA-2015-MeswaniBRSIL #approach #architecture #memory management
- Heterogeneous memory architectures: A HW/SW approach for mixing die-stacked and off-package memories (MRM, SB, DR, JS, MI, GHL), pp. 126–136.
- DAC-2007-BernsteinACEGHIKMPY #3d #challenge #design
- Interconnects in the Third Dimension: Design Challenges for 3D ICs (KB, PA, JC, PGE, DG, WH, MI, SJK, JM, RP, AMY), pp. 562–567.