Travelled to:
3 × USA
Collaborated with:
L.Chang ∅ K.Bernstein P.Andry J.Cann P.G.Emma D.Greenberg M.Ignatowski S.J.Koester J.Magerlein R.Puri A.M.Young
Talks about:
interconnect (1) threshold (1) challeng (1) should (1) integr (1) effici (1) dimens (1) design (1) depend (1) comput (1)
Person: Wilfried Haensch
DBLP: Haensch:Wilfried
Contributed to:
Wrote 3 papers:
- DAC-2012-ChangH #power management
- Near-threshold operation for power-efficient computing?: it depends.. (LC, WH), pp. 1159–1163.
- DAC-2008-Haensch #3d #integration #question #why
- Why should we do 3D integration? (WH), pp. 674–675.
- DAC-2007-BernsteinACEGHIKMPY #3d #challenge #design
- Interconnects in the Third Dimension: Design Challenges for 3D ICs (KB, PA, JC, PGE, DG, WH, MI, SJK, JM, RP, AMY), pp. 562–567.