A methodology for modeling the effects of systematic within-die interconnect and device variation on circuit performance
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Vikas Mehrotra, Shiou Lin Sam, Duane S. Boning, Anantha Chandrakasan, Rakesh Vallishayee, Sani R. Nassif
A methodology for modeling the effects of systematic within-die interconnect and device variation on circuit performance
DAC, 2000.

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@inproceedings{DAC-2000-MehrotraSBCVN,
	author        = "Vikas Mehrotra and Shiou Lin Sam and Duane S. Boning and Anantha Chandrakasan and Rakesh Vallishayee and Sani R. Nassif",
	booktitle     = "{Proceedings of the 37th Design Automation Conference}",
	doi           = "10.1145/337292.337370",
	pages         = "172--175",
	publisher     = "{ACM}",
	title         = "{A methodology for modeling the effects of systematic within-die interconnect and device variation on circuit performance}",
	year          = 2000,
}

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