Interconnects in the Third Dimension: Design Challenges for 3D ICs
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Kerry Bernstein, Paul Andry, Jerome Cann, Philip G. Emma, David Greenberg, Wilfried Haensch, Mike Ignatowski, Steven J. Koester, John Magerlein, Ruchir Puri, Albert M. Young
Interconnects in the Third Dimension: Design Challenges for 3D ICs
DAC, 2007.

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@inproceedings{DAC-2007-BernsteinACEGHIKMPY,
	author        = "Kerry Bernstein and Paul Andry and Jerome Cann and Philip G. Emma and David Greenberg and Wilfried Haensch and Mike Ignatowski and Steven J. Koester and John Magerlein and Ruchir Puri and Albert M. Young",
	booktitle     = "{Proceedings of the 44th Design Automation Conference}",
	doi           = "10.1145/1278480.1278623",
	pages         = "562--567",
	publisher     = "{IEEE}",
	title         = "{Interconnects in the Third Dimension: Design Challenges for 3D ICs}",
	year          = 2007,
}

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