Travelled to:2 × USA
Collaborated with:J.M.Rabaey D.Sylvester D.Blaauw J.Frenkil M.Horowitz W.Nebel T.Sakurai A.Yang P.Andry J.Cann P.G.Emma D.Greenberg W.Haensch M.Ignatowski S.J.Koester J.Magerlein R.Puri A.M.Young
Talks about:interconnect (1) challeng (1) reshap (1) dimens (1) design (1) third (1) power (1) eda (1)
Person: Kerry Bernstein
DBLP: Bernstein:Kerry
Contributed to:
20072003Wrote 2 papers:
- DAC-2007-BernsteinACEGHIKMPY #3d #challenge #design
- Interconnects in the Third Dimension: Design Challenges for 3D ICs (KB, PA, JC, PGE, DG, WH, MI, SJK, JM, RP, AMY), pp. 562–567.
- DAC-2003-RabaeySBBFHNSY
- Reshaping EDA for power (JMR, DS, DB, KB, JF, MH, WN, TS, AY), p. 15.