Travelled to:1 × USA
Collaborated with:K.Bernstein P.Andry J.Cann P.G.Emma D.Greenberg W.Haensch M.Ignatowski S.J.Koester R.Puri A.M.Young
Talks about:interconnect (1) challeng (1) dimens (1) design (1) third (1)
Person: John Magerlein
DBLP: Magerlein:John
Contributed to:
2007Wrote 1 papers:
- DAC-2007-BernsteinACEGHIKMPY #3d #challenge #design
- Interconnects in the Third Dimension: Design Challenges for 3D ICs (KB, PA, JC, PGE, DG, WH, MI, SJK, JM, RP, AMY), pp. 562–567.