Jia-Wei Fang, Martin D. F. Wong, Yao-Wen Chang
Flip-chip routing with unified area-I/O pad assignments for package-board co-design
DAC, 2009.
@inproceedings{DAC-2009-FangWC, author = "Jia-Wei Fang and Martin D. F. Wong and Yao-Wen Chang", booktitle = "{Proceedings of the 46th Design Automation Conference}", doi = "10.1145/1629911.1630002", isbn = "978-1-60558-497-3", pages = "336--339", publisher = "{ACM}", title = "{Flip-chip routing with unified area-I/O pad assignments for package-board co-design}", year = 2009, }