Cost-driven 3D integration with interconnect layers
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Xiaoxia Wu, Guangyu Sun, Xiangyu Dong, Reetuparna Das, Yuan Xie, Chita R. Das, Jian Li
Cost-driven 3D integration with interconnect layers
DAC, 2010.

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@inproceedings{DAC-2010-WuSDDXDL,
	author        = "Xiaoxia Wu and Guangyu Sun and Xiangyu Dong and Reetuparna Das and Yuan Xie and Chita R. Das and Jian Li",
	booktitle     = "{Proceedings of the 47th Design Automation Conference}",
	doi           = "10.1145/1837274.1837313",
	isbn          = "978-1-4503-0002-5",
	pages         = "150--155",
	publisher     = "{ACM}",
	title         = "{Cost-driven 3D integration with interconnect layers}",
	year          = 2010,
}

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