Xiaoxia Wu, Guangyu Sun, Xiangyu Dong, Reetuparna Das, Yuan Xie, Chita R. Das, Jian Li
Cost-driven 3D integration with interconnect layers
DAC, 2010.
@inproceedings{DAC-2010-WuSDDXDL,
author = "Xiaoxia Wu and Guangyu Sun and Xiangyu Dong and Reetuparna Das and Yuan Xie and Chita R. Das and Jian Li",
booktitle = "{Proceedings of the 47th Design Automation Conference}",
doi = "10.1145/1837274.1837313",
isbn = "978-1-4503-0002-5",
pages = "150--155",
publisher = "{ACM}",
title = "{Cost-driven 3D integration with interconnect layers}",
year = 2010,
}