Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC
DAC, 2011.
@inproceedings{DAC-2011-JungMPL,
author = "Moongon Jung and Joydeep Mitra and David Z. Pan and Sung Kyu Lim",
booktitle = "{Proceedings of the 48th Design Automation Conference}",
doi = "10.1145/2024724.2024767",
isbn = "978-1-4503-0636-2",
pages = "188--193",
publisher = "{ACM}",
title = "{TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC}",
year = 2011,
}